JPS6240441Y2 - - Google Patents
Info
- Publication number
- JPS6240441Y2 JPS6240441Y2 JP17022581U JP17022581U JPS6240441Y2 JP S6240441 Y2 JPS6240441 Y2 JP S6240441Y2 JP 17022581 U JP17022581 U JP 17022581U JP 17022581 U JP17022581 U JP 17022581U JP S6240441 Y2 JPS6240441 Y2 JP S6240441Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- bent
- circuit element
- lead
- curved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 38
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 230000037431 insertion Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17022581U JPS5877056U (ja) | 1981-11-17 | 1981-11-17 | 回路素子気密パツケ−ジ用リ−ド線 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17022581U JPS5877056U (ja) | 1981-11-17 | 1981-11-17 | 回路素子気密パツケ−ジ用リ−ド線 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5877056U JPS5877056U (ja) | 1983-05-24 |
JPS6240441Y2 true JPS6240441Y2 (en]) | 1987-10-16 |
Family
ID=29962187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17022581U Granted JPS5877056U (ja) | 1981-11-17 | 1981-11-17 | 回路素子気密パツケ−ジ用リ−ド線 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5877056U (en]) |
-
1981
- 1981-11-17 JP JP17022581U patent/JPS5877056U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5877056U (ja) | 1983-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6240441Y2 (en]) | ||
JPH024513Y2 (en]) | ||
JPS6220141Y2 (en]) | ||
JPH0224266Y2 (en]) | ||
JPH0431745Y2 (en]) | ||
JPS623898Y2 (en]) | ||
JPH054338Y2 (en]) | ||
JPS6312637Y2 (en]) | ||
JPS6210942Y2 (en]) | ||
JPS623897Y2 (en]) | ||
JPH0610307Y2 (ja) | 湿度センサ | |
JPS6210940Y2 (en]) | ||
JPH0331083Y2 (en]) | ||
JPH034057Y2 (en]) | ||
JPH0327342Y2 (en]) | ||
JPS6236112Y2 (en]) | ||
JPS6226847A (ja) | 気密封止形半導体装置 | |
JPH0346503Y2 (en]) | ||
JPH0366150A (ja) | 半導体集積回路装置 | |
JPS6120780Y2 (en]) | ||
JPS5940776Y2 (ja) | 封止構体 | |
JPS63200355U (en]) | ||
JPS6242254U (en]) | ||
JPH01123442A (ja) | 半導体装置用セラミツクパツケージ | |
JPS59180518U (ja) | 気密端子 |